A vapor chamber is a high-end thermal management device that can rapidly spread heat from a small source to a large platform or cold plate.

Vapor Chamber Heat Spreader

Vapor chambers (sometimes referred to as flat heat pipes) are passive heat transport devices that utilize capillary forces to circulate a working fluid between discrete evaporator and condenser regions. Waste heat from electronic devices affixed to the evaporator is absorbed through vaporization of a working fluid and subsequently rejected to a heat sink or cold plate attached to the condenser. Vapor chambers achieve high effective conductivity by transporting heat via vapor generation and flow as opposed to conduction.

KULR’s carbon fiber based vapor chamber heat spreader (FVC) has enhanced capability to transfer heat more efficiently than traditional copper-based heat pipes. Its smaller size and lighter weight provides design flexibility without sacrificing performance while making devices more compact, lighter, and cooler.