Proper selection of thermal interface material is critical for power efficiency and thermal management.

Thermal Interface Material


Various interfaces exist between high power, heat generating components and heat sinks. At times there is small contact area between the two surfaces (interface) due to micro-scale surface roughness. This reduces heat conduction across the interface because air gaps have low thermal conductivity. Surface irregularity is the primary cause of thermal contact resistance. Thermal interface materials are required to enhance the contact between the surfaces and decrease thermal interfacial resistance.

KULR’s proprietary carbon fiber-based thermal interface material (FTI) offers a unique combination of features and benefits for a wide range of high performance applications:

  • High bulk thermal conductivity up to 90W/mK
  • Low thermal resistance R at below 0.10°C in2/W
  • Low contact pressure required. FTI operates below 5 psi and offers full thermal performance at less than 20 psi
  • Wide bond line thickness. FTI offers high thermal performance at up to 1 mm bond line thickness

FTI offers the following unique combination of benefits to customers:

  • Increases power densities of the board layout
  • Relieves mechanical stress
  • Increases thermal stability and reliability
  • High temperature tolerance in harsher working conditions
  • Increases overall product performance and reliability
  • Low contact pressure and high bond line thickness reduces manufacturing costs